Ceramic Fracture & Cracking Analysis
Ceramic fracture analysis locates the fracture origin using fractography (reading mirror, mist and hackle features back to the flaw), then characterizes that flaw with SEM/EDS and compares material properties against the specification. The goal is to separate material or processing flaws from machining damage, thermal shock, contact loading and design stress.
When is it used?
- Cracked or chipped ceramic components
- Thermal-shock failures of refractories and kiln furniture
- Ceramic coating spallation
- Lot-to-lot strength drops
Sample considerations
- Keep all fragments; never fit pieces back together.
- Include a good part from the same lot and the operating temperature and load history.
Laboratories with relevant capabilities
No directory profile currently documents this specific capability. Submit a request and we will look for laboratories that cover it.
Frequently asked questions
- Can a laboratory tell thermal shock from mechanical overload?
- Often, yes — crack patterns, origin location and fracture surface features differ. Combining fractography with the service history gives the most reliable conclusion.