PCB Contamination and Solder Joint Failure Analysis Laboratories
PCB and assembly failure analysis moves from visual and X-ray inspection and electrical isolation to cross-sectioning and microscopy of the defective joint, via or laminate. Where corrosion or leakage is suspected, cleanliness and residue analysis are usually added. This guide helps you decide which of those steps your failure needs.
When is it used?
- Intermittent or leakage-related electrical faults
- Solder joint cracking after thermal cycling or vibration
- Corrosion and dendrite growth on assemblies
- Suspected flux or process residues
- Delamination, via cracking and pad lifting after reflow
Sample considerations
- Provide the failing board with its failure signature and, if possible, a good board from the same build.
- Do not clean, rework or conformally coat the board after the failure; bag it and wear gloves.
- Record process history: solder paste and flux, reflow profile, rework, cleaning and coating.
- Describe the environment in service: humidity, temperature cycling, vibration and applied bias.
- Mark the failing location or net on a photograph or drawing.
Questions to ask a laboratory
- Will you use a bulk cleanliness method, localised extraction, ion chromatography, or a combination — and why?
- Which solder joints will be cross-sectioned, and will you agree the locations with us first?
- Do you run X-ray and electrical fault isolation before destructive work?
- What acceptance criteria will results be compared against — our specification or a named IPC document?
- Can you test a good board alongside the failing one for comparison?
Laboratories with relevant capabilities
No directory profile currently documents this specific capability. Submit a request and we will look for laboratories that cover it.
Frequently asked questions
- Can flux residue cause failures?
- Ionic residues combined with humidity and bias can drive electrochemical migration; cleanliness testing is often part of the investigation.
- Is one failing board enough?
- It can be, but a good board from the same build, plus any other failures, makes it much easier to separate a process issue from a single-board defect.
Confirm standard edition, jurisdiction and actual laboratory scope. Service references are not partnerships or endorsements.