Semiconductor Package & Device Failure Analysis — Localize, Then Open
Semiconductor failure analysis localizes a defect within a package or die before any decapsulation or deprocessing. Package-level and die-level evidence require different techniques, and opening a device prematurely can destroy the defect it was meant to reveal.
Characterize electrically first
Curve tracing, parametric comparison against a known-good unit and the failing test conditions define the signature before physical work begins. Record the test programme, binning history and handling; ESD, EOS and latch-up signatures overlap, and the electrical evidence often decides which physical technique is worth applying.
Localize non-destructively where possible
X-ray, scanning acoustic microscopy and emission or thermal techniques can indicate delamination, wire-bond damage or leakage sites through an intact package. Ask which localization methods suit the package type — flip-chip, wire-bonded, power device — and what each can and cannot resolve before authorizing decapsulation.
Control the destructive sequence
Decapsulation chemistry, mechanical cross-sectioning and deprocessing each carry artefact risks. Agree the sequence, the points at which findings are reviewed, and the evidence retained at each stage. Request reporting that separates the localized defect, the supported failure mechanism and any process or handling causes that remain unproven.
Sample considerations
- Provide failed and known-good units, the failing test conditions and lot/history information.
- Describe handling and ESD precautions already applied; ship with appropriate protection.
- Agree decapsulation authorization, review points, imaging deliverables and sample retention.
Questions to ask a laboratory
- Which localization techniques suit this package before opening it?
- What artefacts can each destructive step introduce, and how are they controlled?
- How will the report distinguish defect, mechanism and unproven contributing causes?
Laboratories with relevant capabilities
- Metallurgical Technologies (Mooresville, NC) — Profile summary mentions “ic failure analysis”
Frequently asked questions
- Is semiconductor failure analysis destructive?
- Non-destructive steps such as X-ray and electrical characterisation come first; decapsulation and cross-sectioning that follow are destructive.
- How many failed parts should I send?
- More than one where possible. Several failures from the same population, together with good parts for comparison, make it easier to tell a systematic defect from a one-off event.
Sources and scope references
JEDEC — semiconductor standards and failure-analysis methods
Related testing briefs
Confirm standard edition, jurisdiction and actual laboratory scope. Service references are not partnerships or endorsements.